Table of Contents
Assignment background
In recent semiconductor mounting processes, precision dispensing of underfill material is required to ensure the mechanical strength and reliability of the joints after mounting chips such as CSP and BGA on the board. However, conventional nozzle proximity dispensers have the following challenges:
- It is difficult to apply to small gaps, and the liquid spreads and accumulates.
It is necessary to apply the liquid to narrow gaps, and using a thin nozzle results in liquid remaining at the tip of the nozzle, which often comes into contact with the mounted components and leads to defects, resulting in reduced yields. - The nozzle comes into contact with the tip, making it difficult to control the fillet shape.
Errors in Z-axis control caused excessive application, which resulted in overflow and contact with components, leading to component damage and reduced reliability. - Difficulty in shortening takt time, productivity issues
The nozzle’s Z-axis up/down movement wasted time, which increased takt time and created productivity issues.
Benefits
By introducing the high-speed non-contact dispenser “BEATRUM” into this process, these issues have been significantly improved. The non-contact, highly accurate micro-dot dispensing has achieved the following results:
- Non-contact, high-precision dot application prevents the risk of scattering or contact.
The nozzle does not come into contact with the board or chip, and can dispense with pinpoint precision even into tiny gaps, significantly reducing liquid pooling and splashing on adjacent components. - Stable fillet control and high repeatability
The uniformity of the fillet shape has improved, the appearance quality has stabilized, and the man-hours for re-application and inspection processes have been reduced. - High frequency, high throughput, stable dispensing
Coating can be achieved by a horizontal sliding motion without moving the nozzle along the Z axis, enabling continuous coating at up to 250Hz, which has greatly contributed to shortening the takt time of the production line and reducing costs.
Application video
Introduced products
High precision non-contact dispenser BEATRUM
This ultra-high-speed, non-contact dispenser achieves the high-precision dot application, splatter-free filling into narrow spaces, and minimized fillets required for underfill applications. It solves the issues faced in the underfill process for fine gaps in CSPs, BGAs, and other devices.
- Non-contact and high-speed response enables stable dispensing even in narrow spaces around chips
- High-speed dispensing at 250Hz enables uniform and frequent dot application.
- Zero risk of damage to parts due to nozzle contact. Z-axis control is not required, contributing to shorter takt time.
- Compatible with nozzle heaters and external control, and can be used for a wide range of underfill materials from low to high viscosity
